The HTC M7, which is all set to make it to the MWC trade show (or at a dedicated event in London) next month has been the talk of the town lately. According to recent reports, some of major U.S. carriers have been confirmed to carry this device. The rumors of M7 are already starting to pick up steam in late 2012. After we got to see some alleged press images of this device and got treated to a couple of real images with Sense 5 UI topped on Android OS. Today, we got to see the front and back plates of the HTC M7 handset. Thanks to ETrade Supply
You can observe there’s a new placement for camera flash. and the front-facing camera has been moved as well, compared to the previous flagships of the manufacturer, such as HTC Droid DNA/Butterfly, and One X handsets, but carrying a similar rear camera/logo layout. Other than these changes, we notice a tiny hole on the back, which refers to a noise-cancelling microphone, and the panel is made out of aluminum alloy. The screen is said to be 4.7-inches, touting 1080p resolution, which measures to pixel density of 468 ppi.
The video shows a power/lock key on top, a physical camera button on the side of the unit, and it also shows off a speaker frill on the bottom of the handset, which is similar to an early render, leaked earlier this month.
HTC M7 is expected to be powered by a quad-core 1.7 GHz Snapdragon processor, 13MP primary camera with a bright f/2.0 aperture and it is capable of recording super slow-motion and video HDR in 1080p HD quality, 2MP front-snapper helps you to make 1080p video calls.It also comes with 2GB of RAM, and 32 GB of internal storage, Beats Audio enhancements, LTE support up to 42Mbps, new 802.11 ac wireless standard. and a 2300mAh battery, while it ships with Android 4.1 Jelly Bean OS.
Don’t forget to watch the video below, so that you can get a clear idea of what the HTC M7 is all about.
Source: ETrade Supply