Oppo is expected to announce the Find X6 series of phones in China in the coming weeks, and Recently, leaks and rumors about a X6 Pro have started picking up pace. Fresh new leaked renders revealed the design of both the Oppo Find X6 and Find X6 Pro handsets.
Digital Chat Station via Weibo has managed to get its hands on an alleged official render images of the Oppo Find X6 and X6 Pro’s white color variants, showing off their back sides. From what we can tell, the Find X6 phone’s rear seems to have a mix of both ceramic and leather-like texture. This design could become one of the key selling points for this device. The Find X6 Pro has a different design on its back and the whole back panel looks like it is made of ceramic.
The leaked images also show Hasselblad and MariSilicon branding on the rear of the both devices. The tipster has also leaked some new information about the display of these handsets. Both phones have a large circular camera design with triple camera setup, one of which periscope telephoto can be spotted in the lower-left corner of the camera island. It seems circular cameras will become the mainstream design of flagship phones. The recently released OnePlus 11 has the similar type of rear camera design.
On the display front, the top-tier Find X6 Pro is said to rock an AMOLED QHD Plus panel with a resolution of 3168 x 1440 pixels, measuring 6.8 to 6.9 inches. It also features LTPO 2.0 tech and a 120Hz refresh rate. The display is also capable of transmitting a peak brightness of 1800 nits, which is slightly better than the 1750 nits of the upcoming Galaxy S23 Ultra, but a little lower than the 1900 nits of the recently launched Xiaomi 13 Pro.
The Oppo find X6 is expected to ship with a 6.7-inch curved AMOLED 1.5K display with a resolution of 2772 x 1240 pixels, and it can also output 2160 Hz PWM dimming.
Based on the recent rumors, Oppo Find X6 Pro’s rear camera setup is slated to include a 50 MP main camera with a 1” type Sony IMX989 sensor and 23mm equivalent focal length, aong with a 50MP ultrawide module (IMX 890) and an IMX 766 or IMX 890 telephoto lens with 3x optical zoom. The company will launch this device with the latest Snapdragon 8 Gen 2 chipset onboard.
On the other side, the Find X6 is expected to ship with a 50MP Sony IMX890 with an f/1.8 aperture and OIS alongside unconfirmed 50MP ultrawide and 50MP telephoto modules, while the entire handset runs on the Snapdragon 8+ Gen 1 chipset, and a 4,800mAh battery with 80W charging capability.
Both devices will be launched soon, but there’s no word on its launch date yet. The tech brand will likely announce these flagships in China first, followed by other global markets later in the year.
Source: Weibo