Recently, Apple released the iPhone 5 running iOS 6. Two weeks before release, it was reported that the phone will be using a Apple’s A6 Processor packed with Samsung RAM but ifixit’s teardown reveals that instead of a Samsung RAM, the handset packed a RAM from the leading manufacturer of Dynamic Random Access Memory (DRAM) integrated circuits, Elpida (B8164B3PM 1GB LP DDR2 SDRAM).
Earlier this month, Reuters had mentioned that Apple had reduced memory chip orders from Samsung and alleged that Toshiba, Elpida and Hynix would fill the gap, which would provide both DRAM and NAND chips. Some reports have also claimed that Elpida already sells as much as half of its memory output to Apple.
iFixit’s teardown of Apple’s latest and greatest reveals exactly how easy the device can repaired as well as its components. iFixit says that “it may be the best repairable iPhone we have seen ever”. The phone can be opened easily from front-to-back with a suction cup, means that the glass should not be difficult to replace for most and gave it a repairability score of 7 out of 10 after finding the device to be more easily repairable than previous iPhone models. Its battery and display assembly are also easily removable. The problem of less responsive over time in home button found on iPhone 4 and 4S may not continue anymore in Phone 5.It is also housed in a metal support bracket which can control to break for most.
Finally, the iPhone 5 looks to be reasonably scratch resistant, with the black aluminum coating and sapphire crystal lens on the rear camera with 8 megapixel iSight camera, 8-pin Lightning connector, 4G LTE connectivity, iOS 6 and 4’’ 1136×640 pixel(326ppi) Retina display . It contains 1GB Elpida LP DDR2 SDRAM, separate LTE data and voice radio is Qualcomm’s MDM9615M, making the iPhone 5 the first smartphone to ship with this component. It allows for simultaneous voice and data transfer, though Sprint and Verizon don’t support this.
The iPhone 5 arrived first in Australia today, following in other regions around the world.