MWC 2011: Qualcomm Announces 84Mbps HSPA+ Chipset MDM8225


Qualcomm announced its Mobile Data Modem (MDM) chipset for use in mobile broadband data devices, the MDM8225 in MWC 2011. The latest mobile chipset will offers full support for HSPA+ Release 9/HSPA+ 84Mbps. The MDM8225 will be fabricated using the 28nm technology node.  Qualcomm is expecting to work with T-Mobile USA to deliver 84 Mbps HSPA+ capability in 2012 with the MDM8225.

The MDM8225 chipsets will support the latest Qualcomm Interference Cancellation & Equalization (Q-ICE) receiver, a feature that removes interference in a cellular network to increase network capacity and enhance the mobile broadband user experience.

Samples of the MDM8225 are anticipated to be available in Q4 2011, which means devices to be rolled out in early 2012.

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