A new leak has revealed some interesting information about the upcoming flagship smartphone from Sony Mobile, the Xperia 1 V, which is expected to be released as a summer model through carriers in Japan around June.
As we await the official release, leaked renders, screen protectors, and protective cases of the device have already been circulating, revealing almost its entire design. But amidst this, there is newly leaked information regarding the thickness and cooling system of the Xperia 1 V that has emerged, giving us an insight into what we can expect from this upcoming smartphone.
Recently posted on Weibo, it was revealed that the Xperia 1 V will be the thickest Xperia 1 model ever released. This is due to the inclusion of a very thick vapor chamber for cooling, which is the largest ever included in a Sony smartphone. The CAD data that has recently been leaked shows that the Xperia 1 V has a thickness of 8.54mm, making it the thickest in the Xperia 1 series.
For comparison, previous Xperia 1 models have had the following thicknesses:
- Xperia 1: 8.2mm
- Xperia 1 II: 7.9mm
- Xperia 1 III: 8.2mm
- Xperia 1 IV: 8.2mm
The reason behind the Xperia 1 V being the thickest is not only due to the large size of the vapor chamber for cooling, but also due to other design choices that make the device thicker. This suggests that Sony is focusing on heat dissipation for the Xperia 1 V, possibly to avoid the heat dissipation issues that plagued its predecessor, the Xperia 1 IV, at launch. However, the fact that it is now expected to be the thickest Xperia 1 model is surprising.
While there is no reliable information yet on the battery capacity of the Xperia 1 V, if it remains the same as its predecessor at 5000mAh, it’s likely that the increased thickness is due to changes made to the heat dissipation system. It’s important to note that a thicker device doesn’t necessarily mean that it’s heavier or less comfortable to hold, as the weight distribution and material choice also play a role in determining the overall feel of the device.
Overall, the leaked information about the Xperia 1 V’s thickness and cooling system suggests that Sony is prioritizing heat dissipation for this upcoming smartphone. It will be interesting to see how the device performs in real-world usage, especially in hot and humid conditions, and whether the changes made to the heat dissipation system are successful in addressing any issues that may arise.