MWC 2011: Qualcomm Announces 84Mbps HSPA+ Chipset MDM8225
Qualcomm announces the MDM8225 in MWC 2011, which will offers full support for HSPA+ Release 9/HSPA+ 84Mbps. T-Mobile USA is expecting on delivering 84 Mbps HSPA+ capability in 2012 with the MDM8225.