MediaTek Unveils High-Performance Dimensity 9200+ Chipset for Android Phones

Dimensity 9200+ Chipset

As confirmed late last month, MediaTek unveiled the Dimensity 9200+ on Wednesday. This is the latest chipset from MediaTek that will start to appear in Android phones as early as May.

The high-end chipset market for Android smartphones is primarily dominated by Qualcomm, with almost all of the top Android phones incorporating a Snapdragon SoC. However, in 2021, MediaTek, which is predominantly recognized for its low-end chips, made an entry into the high-end chipset market with the launch of its Dimensity 9000.

Last year’s MediaTek Dimensity 9200 chipset came as a surprise with its power-saving capabilities, support for Wi-Fi 7, and hardware-based ray tracing, among other features. Now, on Wednesday, the company has taken this same processor and cranked up the performance to new levels.

The latest Dimensity 9200+ chip from MediaTek is an upgrade from last year’s Dimensity 9200, which featured new CPU cores, a more efficient 4nm process node, and the Arm Immortalis GPU. This year’s Dimensity 9200+ further pushes the limits of the chipset, promising even better performance and efficiency.

Like most + chips, the Dimensity 9200+ from MediaTek is an enhanced version of its predecessor, the Dimensity 9200. This latest system-on-a-chip features an overclocked Cortex-X3 core, which runs at a faster 3.35GHz compared to its predecessor’s 3.05GHz. The CPU also has 3x A715 and 4x A510 cores, clocked 200MHz higher than the Dimensity 9200, resulting in maximum speeds of 3GHz and 2GHz, respectively. MediaTek also claims to have improved the performance of the Immortalis-G715 GPU by 17%.

In spite of the clock speed boost, MediaTek claims that the Dimensity 9200+ maintains the same power efficiency as its predecessor. Additionally, the SoC is still manufactured using TSMC’s 2nd generation 4nm process. Other features of the chip, including the modem, ISP, APU, and connectivity options, remain unaltered.

Here is the full list of key features of the MediaTek Dimensity 9200+:

  • HyperEngine 6.0 for adaptive performance technology to improve gaming experience
  • Second generation TSMC 4nm-class process for ultra-slim designs
  • Sixth generation AI Processing Unit (APU 690) for efficient AI-noise reduction and AI-super resolution tasks
  • MediaTek Imagiq 890 for powerful flagship image signal processing with support for bright, sharp images and videos in low-light scenarios
  • MediaTek MiraVision 890 for adaptive refresh rate technology and motion blur reduction for a fluid user experience
  • MediaTek 5G UltraSave 3.0 for power efficiency technologies to optimize battery life for all 5G connection conditions.

In contrast, the Snapdragon 8 Gen 2 for Galaxy devices may not offer a significant advantage over the Dimensity 9200+ in terms of clock speed, with its Cortex-X3 topping out at 3.36GHz. However, the performance cores are fixed at 2.8GHz.

The release of smartphones powered by the Dimensity 9200+ this May is highly anticipated, as they may even surpass the raw speed of the Galaxy S23 Ultra. It is notable that there hasn’t been another mobile processor that has surpassed the 3GHz threshold with secondary cores. It remains to be seen if this translates into tangible performance gains, but the prospect is certainly exciting.

iQOO has officially announced that its upcoming smartphone, the iQOO Neo8 Pro, will be the first device to feature the Dimensity 9200+ chipset. The release date of the phone is expected to be revealed by the company tomorrow.

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